Overview
TES has developed a wide port-folio of manufacturing technologies ranging from simple printed circuit boards activities, down to most complex hybrid products assembly that use electronics in conjunction with other domains such as chemistry, optics, or mechanics for example. TES has pushed these technology’s control far enough to be able to propose them in a sustainable commercial scheme where strong certification such as automotive ISO/TS 16949 is mandatory.
TES standard PCA (Printed Circuit Assembly) technology :
- Surface-mount component placement capability: large fine-pitch BGA, 0402; older through-hole mounting also supported
- Extended connector placement capabilities
- Reflow, wave, iron soldering
- Lead / Lead-free / Mix: reflow thermal profiles modification and optimization to take care of new “RoHS-only” components. Component D/B customized for RoHS related enquiries / management, enabling TES to offer efficient RoHS BOM migration.
Wide spectrum of expertise: not only leading-edge electronics board manufacturing know-how, but also expertise in glues, optics, mechanics, test, allowing TES to offer system integration level services.
TES has die-level assembly capability and expertise :
- TES has developed custom tooling for die preparation and manipulation: passivation removal, die-cleaning, extremely thin die handlers (<50µm).
- Chip-On-Board (COB), Chip-On-Flex (COF)
- Wire-bonding or Flip-chip connection
- Expert in gluing technics
- Customized cleaning machines for die processing
Two special markets involving chip level processing are Micro-Electro-Mechanical Systems (MEMS) and Micro-Opto-Electro-Mechanical Systems (MOEMS).
TES has put special effort to develop a specific know-how :
- Chip-On-Flex
- Process definition and materials selection for temperature range compatibility
- Optics: mirrors, lenses, light guides assembly, thickness control
- Hybrid optical / electronics assembly, staging glues, PCBs, custom packaging
- Production, test and delivery work-flow
- Overall process control and repeatability for yield stabilization
- Clean areas working procedures
Mechanical characteristics can be very important for electronics products: look ’n’ feel (touch, colour, shape), power dissipation capability, weight, vibration or shock resistance, etc. Most of these items are handled ahead of manufacturing at design phase, but nevertheless require industrial & procurement constraints to be well defined and checked at early design phase by our NPI engineers:
- Casing: metal, plastics, including tooling design and optimization coordination
- MMI optimization: push buttons, keyboards, LCD integration, audio devices (buzzes, loud speakers), using joints, zebra connectors, elastomer, thin films, etc
- Special needs: anti-tampering, water/dust protection for systems as demanding as boat or motorbikes equipment
- Paints, inks
- Packaging for distribution
TES has a strong industrial test tools and expertise, enabling product test and programming work-flow optimization depending on volume, product certification constraints, and required level of automation :
- PCB electrical test
- Automatic Optical Inspection, X-ray
- Flying Probe Test, ICT, Boundary Scan
- Device test and/or functional Programming
- Unitary / System Functional test
- Full process traceability thanks to tester connection with TES supply chain management database
- Special test capabilities in Optics and RF
TES develops technologies and fully owns capacities for its manufacturing offer :
- 2 sites : Langon, France and Penang, Malaysia
- dedicated means for new product introduction (NPI): tools and staff, for optimized lead-time and bridge between R&D and manufacturing
- SAP based supply chain and customer enquiries management
- Clean room (down to 100 class) suitable for chip level processing, optics, MEMS and MOEMS
- Factory cluster areas, dedicated to customers requiring high level of security management, including per employee information and facility access control, and critical components full traceability including scrap control.
TES is mixing its deep manufacturing technology know-how with a strong customer oriented culture to offer to its customer base a full product level proactive improvement research, targeting continuous product quality, cost, and sustain improvement.